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INTEGRATED CIRCUITS
DATA SHEET
TDA6120Q Video output amplifier
Preliminary specification Supersedes data of 1997 Jul 17 File under Integrated Circuits, IC02 1997 Aug 27
Philips Semiconductors
Preliminary specification
Video output amplifier
FEATURES * High large signal bandwidth of 32 MHz (typ.) at 125 V (p-p) * High small signal bandwidth of 47 MHz (typ.) at 60 V (p-p) * Rise/fall time of 12.5 ns for 125 V (p-p) * High slew rate of 10 V/ns * Low static power dissipation of 2.5 W at 200 V supply voltage * High maximum output voltage * Bandwidth independent of voltage gain * Maximum overall voltage gain over 46 dB * High Power Supply Rejection Ratio (PSRR) * Fast cathode current measurement output for dark current control loop * Differential voltage input. ORDERING INFORMATION TYPE NUMBER TDA6120Q PACKAGE NAME DBS13P DESCRIPTION plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm) GENERAL DESCRIPTION
TDA6120Q
The TDA6120Q is a single 30 MHz, 125 V (p-p) video output amplifier contained in a plastic DIL-bent-SIL power package. The device uses high-voltage DMOS technology and is intended to drive the cathodes of a CRT in High Definition TVs (HDTVs) or monitors.
VERSION SOT141-8
1997 Aug 27
2
Philips Semiconductors
Preliminary specification
Video output amplifier
BLOCK DIAGRAM
TDA6120Q
handbook, full pagewidth
IIN 5 n.c. 9, 11
VDD 10 MIRROR 4x out CASCODE 12 13
TDA6120Q
in
1x VCC 6 0.7 pF MIRROR in 1x out out 1x out 4x in CURRENT INPUT + J 5 mA CASCODE 1x
OUTC OUT
7
OUTM
VIN-
2
1 RC-
3 RC+
4 VIN+
8
MGK440
GND
Fig.1 Block diagram.
handbook, full pagewidth
Vref
+12 V
+200 V
Cr 10 nF
CCC 10 F
CC 22 nF
CD 22 nF
CDD 3.3 F
Dflash OUTC
VIN- 2 4
VIN+ 6
VCC 8
GND
VDD 10
12
TDA6120Q
1 RC- Ri 442 VIN C1 68 pF 3 RC+ 5 IIN 7 OUTM 9 n.c. 11 n.c. 13 OUT
Ria 22
Rf 22 k
Rflash 147 CRT
MGK441
Fig.2 Top view.
1997 Aug 27
3
Philips Semiconductors
Preliminary specification
Video output amplifier
PINNING SYMBOL RC- VIN- RC+ VIN+ IIN VCC OUTM GND n.c. VDD n.c. OUTC OUT PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 DESCRIPTION inverting input pre-emphasis network inverting voltage input non-inverting input pre-emphasis network non-inverting voltage input feedback current input low supply voltage (12 V) cathode current measurement output power ground and heatsink not connected high supply voltage (200 V) not connected cathode output feedback output
handbook, halfpage
TDA6120Q
RC- 1 VIN- 2 RC+ 3 VIN+ 4 IIN 5 VCC 6 OUTM 7
TDA6120Q
GND 8 n.c. 9 VDD 10 n.c. 11 OUTC 12 OUT 13
MGK438
Fig.3 Pin configuration.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VCC Vi Vi(dif) Vi(pe) Vi(dif)(pe) VIIN VOUTM Vo Tstg Tj VESD PARAMETER high supply voltage low supply voltage input voltage (pins 2 and 4) differential mode input voltage (pins 2 and 4) pre-emphasis input voltage (pins 1 and 3) differential mode pre-emphasis input voltage (pins 1 and 3) input voltage (pin 5) measurement output voltage output voltage (pins 12 and 13) storage temperature junction temperature voltage peak human body model voltage peak machine model Note 1. 1250 V for IIN (pin 5). note 1 CONDITIONS 0 0 0 -VCC 0 -VCC 0 0 0 -55 -20 - - MIN. MAX. 280 20 VCC VCC VCC VCC 2VBE 20 VDD +150 +150 2000 300 V V V V V V V V V C C V V UNIT
1997 Aug 27
4
Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6120Q
MGK442
handbook, halfpage
20
Ptot (W)
16
(1)
12
8
4
(2)
0 -20
0
20
40
80
120 160 Tamb (C)
(1) Infinite heatsink. (2) No heatsink.
Fig.4 Power derating curve.
QUALITY SPECIFICATION Quality specification in accordance with "SNW-FQ-611 part E". THERMAL CHARACTERISTICS SYMBOL Rth j-c PARAMETER thermal resistance from junction to case VALUE 3.0 UNIT K/W
1997 Aug 27
5
Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6120Q
CHARACTERISTICS Operating range: Tj = -20 to +150 C; VDD = 180 to 210 V; VCC = 10.8 to 13.2 V; VOUTM = 4 to 20 V; VVIN- = 1.5 to 5 V; VVIN+ = 1.5 to 5 V. Test conditions: Tamb = 25 C; VDD = 200 V; VCC = 12 V; VVIN+ = 3 V; VOUTM = 6 V; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth h = 4 K/W; test circuit of Fig.5; unless otherwise specified. SYMBOL IDD(q) ICC(q) Ibias VOUTC VOUTC(T) PARAMETER quiescent high voltage supply current quiescent low voltage supply current input bias current (pins 2 and 4) DC output voltage (pins 12 and 13) DC output voltage temperature drift (pins 12 and 13) offset current of measurement output linearity of current transfer input capacitance (pins 2 and 4) maximum dynamic peak output current (pin 12) minimum output voltage (pin 12) maximum output voltage (pin 12) internal gain small signal bandwidth (pin 12) large signal bandwidth (pin 12) cathode output propagation time 50% input to 50% output (pin 12) VOUTC(AC) = 60 V (p-p); VOUTC(DC) = 100 V VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Figs 6 and 7 VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Fig.6 CONDITIONS VOUTC = 100 V VVIN- = VVIN+ VOUTC = 100 V VVIN- = VVIN+ VVIN- = VVIN+ 8 25 - 70 - MIN. 10 31 30 100 - TYP. MAX. UNIT 12 39 - 130 5 mA mA A V V
I(offset)OUTM IOUTM/IOUTC Ci IOUTC(max) VOUTC(min) VOUTC(max) Gint Bs Bl tpd
note 1 -50 A < IOUTC < +50 A; note 1 VOUTC = VOUTC(max) 20 V < VOUTC < VDD - 20 V
-40 - - - - VDD - 10 1.68 40 28 10
+20 1.0 3 100 4 VDD - 6 1.87 47 32 -
+120 - - - 10 - 2.08 - - 15
A
pF mA V V
MHz MHz ns
to(r)
cathode output rise time 10% output to 90% output (pin 12)
10
14
18
ns
1997 Aug 27
6
Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6120Q
SYMBOL to(f)
PARAMETER cathode output fall time 90% output to 10% output (pin 12)
CONDITIONS VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Fig.7 VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Figs 6 and 7 VVIN- = 2 V (p-p) square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns VVIN- = 2 V (p-p) square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Figs 6 and 7 VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Figs 6 and 7 f < 50 kHz; note 2 f < 50 kHz; note 2 10
MIN.
TYP. 12.5
MAX. UNIT 15 ns
tst
settling time 50% input to (99% < output < 101%) (pin 12)
-
-
250
ns
SRr
slew rate rise between 30 V to (VDD - 30 V) (pin 12)
-
8
-
V/ns
SRf
slew rate fall between (VDD - 30 V) to 30 V (pin 12)
-
10
-
V/ns
OVr
cathode output voltage overshoot rise (pin 12)
-
5
-
%
OVf
cathode output voltage overshoot fall (pin 12)
-
20
-
%
PSRRh PSRRl Notes
high voltage power supply rejection ratio low voltage power supply rejection ratio
- -
44 48
- -
dB dB
1. The operating range of the measurement output OUTM is 4 to 20 V. Below 4 V, OUTM acts as a voltage source with an output resistance such that the maximum current input from OUTM is 2 mA. a) The linearity of the current transfer is guaranteed until a junction temperature of 125 C. 2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.
1997 Aug 27
7
Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6120Q
handbook, full pagewidth
+12 V
RCC 47 CCCC 47 F CCC 10 nF CDD 10 nF CDDD 10 F
RDD 47
+200 V
C10 VIN Ra 50 C11
22 nF 10 F VIN- 2 1 C1 68 pF Ri 442 RC+ VIN+ 3 4 8 GND VCC 6
Rf
Rba 1 k
RC-
22 k VDD 10 IIN 5 OUT 13 12 7 OUTM C7 Im 3.3 pF C9 136 pF
MGK443
Vref Rbb 1 k C12 C13 22 nF 10 F
TDA6120Q
OUTC
Rflash 147 C8 6.8 pF R3 2 M VOUT R2 100 k
Ria 22
Rf Overall gain = G int x ----Ri
Fig.5 Test circuit with gain of 40 dB.
1997 Aug 27
8
Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6120Q
x Vi
0 t
x tst overshoot (in %) 162.5 150 Voc 100 161.25 163.75
50 37.5
t to(r) tpd
MGK444
Fig.6 Output (pins 12 and 13; rising edge) as a function of input signal.
1997 Aug 27
9
Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6120Q
x Vi
0 t
x tst
162.5 150 Voc 100 overshoot (in %) 50 37.5 38.75 36.25 t to(r) tpd
MGK445
Fig.7 Output (pins 12 and 13; falling edge) as a function of input signal.
FLASHOVER PROTECTION The TDA6120Q does NOT include protection diodes that clamp the cathode output pin to the high voltage supply pin during a CRT flashover discharge. Therefore an external high voltage reverse biased diode has to be connected between the OUTC pin and the VDD pin. An external 147 carbon high-voltage resistor in combination with a 2 kV spark gap between the cathode and ground will limit the maximum clamp current (for this resistor value, the CRT has to be connected to the main printed-circuit board).
This external network causes an increase in the rise and fall times and a decrease in the overshoot. Pin 10 must be decoupled to pin 8: * By a capacitor >22 nF with good HF behaviour (e.g. foil). This capacitor must be placed as close as possible to pin 10 and pin 8; definitely within 5 mm. * By a capacitor >3.3 F on the picture tube base printed circuit board (common for three output stages).
1997 Aug 27
10
Philips Semiconductors
Preliminary specification
Video output amplifier
TEST AND APPLICATION INFORMATION Dissipation Regarding dissipation, distinction must be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). The static dissipation of the TDA6120Q is due to supply currents, and currents in the feedback network and CRT. The static dissipation is given by the following equation: V OUTC P stat = V CC x I CC + V DD x I DD - V OUTC x -------------------------R f - I OUTC Where: Rf = feedback resistance IOUTC = DC cathode current. The dynamic dissipation is given by the following equation: P dyn = V DD x ( C L + C int ) x f x V OUTC ( p - p ) x b Where: CL = load capacitance
TDA6120Q
Cint = effective internal load capacitance (approximately 7 pF) f = frequency VOUTC(p-p) = output voltage (peak-to-peak value) b = non-blanking duty cycle (0.8). The IC must be mounted on the picture tube base printed-circuit board to minimize the load capacitance CL. Switch-off The voltage at output pins OUT and OUTC will be pulled to ground when the low voltage supply voltage (VCC) is switched off.
1997 Aug 27
11
Philips Semiconductors
Preliminary specification
Video output amplifier
INTERNAL PIN CONFIGURATION
TDA6120Q
handbook, full pagewidth
VCC 6
VDD 10
VIN-
2 ESD ESD 12 ESD ESD
RC-
1
OUTC
TDA6120Q
VIN+ 4 ESD 3 ESD
RC+
ESD ESD 13 OUT
IIN
5 ESD 7 ESD OUTM
8 GND
MGK439
Fig.8 Internal pin diagram.
1997 Aug 27
12
Philips Semiconductors
Preliminary specification
Video output amplifier
PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm)
TDA6120Q
SOT141-8
non-concave x D Dh
Eh
view B: mounting base side
d
A2
B j E A
L3 L Q 1 Z e e1 bp wM 13 m e2 vM c
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 3.4 e1 1.7 e2 5.08 Eh 6 j 3.4 3.1 L 8.4 7.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.6 w 0.25 x 0.03 Z (1) 2.00 1.45
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT141-8 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
1997 Aug 27
13
Philips Semiconductors
Preliminary specification
Video output amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA6120Q
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Aug 27
14
Philips Semiconductors
Preliminary specification
Video output amplifier
NOTES
TDA6120Q
1997 Aug 27
15
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/02/pp16
Date of release: 1997 Aug 27
Document order number:
9397 750 02701

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